Copyright © 2002 United Electronics, Corp., Inc.
United Electronics, Corp., Inc.
Toll Free: 800 352 1959
LAMINATES / CONSTRUCTION:
* Lamination types:
-FR-1, CEM-1, FR-4
-High Tg Epoxy(170+Tg)
-Polyimides
-GETEK
-Arlon (PTFE)
-Rogers
-Isola
-Taconic
-Nelco
-Lead Free Laminates (RoHS, WEEE)
-Thermagon (Aluminium)
* Copper cladding
-Inner layermax.Cu weight :6 oz.
-Outer layer max.Cu weight : 10 oz.
-Min. Cu weight :1/4 oz.
* Max available process panel size: 20" X 30"
* Multi- layer constructions :
-Min. core thickness : .004"
-Max. layer count : 12
-Min.Multi-layer thickness : .025"
-Max.Multi-layer thickness : 0.150"
-Blind/buried vias - sequential lamination only
5321 N. Pearl Street, Rosemont, IL 60018